Plasma-Therm’s Singulator® models MDS-100 and MDS-300 are the first volume-production-ready plasma singulation systems.
Singulator® systems deliver unique benefits compared to traditional dicing techniques, especially for thin and ultra-thin wafers:
- Smooth sidewalls
- No lateral damage
- Improved die strength
- Street size as small as 10μm and less
- Dicing of non-rectangular dies (rounded corners, key shape, etc.)
Tape-frame cassette handling system
- Supports industry-standard dicing tape with plastic or metal frames
- Load two cassettes with up to 25 frames each
- Continuous operation for 4-, 6-, 8-inch wafers on 8-inch tape frames, and 12″ wafers on tape frames
- Integrated laminar flow and anti-static bars for operation in backend environment
High-rate process chamber
- Yield-enhancing, proprietary plasma source
- Highest throughput — up to 3,000 mm/sec dicing speed equivalent
Process control
- Integrated endpoint technology with EndpointWorks™ software compensates for non-uniform substrate thickness
On-tape process extendibility
- TSV reveal
- Wafer thinning
- Stress relief
Enhanced productivity with Cortex® control system
- Automatic data logging and charting
- Automated maintenance scheduler
- Factory system integration (SECS/GEM)
