Call us
Logo - Eden Lab

ALD Technology

Contact Now

Atomic Layer Deposition (ALD), used to deposit films on a monolayer scale, has become widely adopted in R&D and various industries.

The ALD mechanism proceeds by a limited surface chemical reaction, and thus ALD processes offer superior deposition uniformity and conformality over varied substrate sizes and shapes.

ALD process cycle

ALD is a time-multiplexed process comprising of cycles with 4 steps in a cycle.

After completion, the ALD cycle is started again, producing layer-by-layer growth.

Precursor exposure

During step 1 of the cycle, reactive species are introduced in the reactor and chemisorbed on the wafer surface.

Purge

In process step 2, purging of the reactor is required to remove all traces of the reactant.

Reactant exposure

The second reactant is introduced into the reactor in step 3. The reactant molecules can react with the adsorbate violently upon plasma excitation (plasma enhanced ALD, or PEALD). Due to the self-limiting process, and with the proper choice of reactants and process conditions, only a thin layer, close to a monolayer in thickness, is formed during the chemical reaction.

Why Choose Eden Lab

Australian Company
Top Support
Full Spectrum of Products
Years of Experience

Fast Shipping

Ready to Ship Freeze Dryers

Top Support

Local Dedicated Support

Peace of Mind

Covered By Australian Law