PLASMA THERM – Mask Etcher® Series

A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems.

Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm.

Mask Etcher 2-V Evolution

Hardware

• Dedicated platform specifically built for the highly specialized photomask market
• Several front-end handling options:
  – Ballroom/Bulkhead mounting
  – Automated load station (ALS)
  – SMIF on Automated Frond End (AFE)

Endpoint

Integrated multifunctional endpoint capability with EndpointWorks

• Laser Interferometry
• OES
• System Parameters
• Custom input (e.g. RGA)

Software

• User friendly SEMI standard interface
• Comprehensive data logging
• Real-time process data display
• Fully integrated endpoint system
• Factory automation compatible (SECS/GEM)
• Multiple user access levels
• Alarm history

Process

• Compensation for uniformity and loading effect
• Low etch bias
• Good feature fidelity
• Low particle and defect
• Low line edge roughness
• Maximized productivity and low cost of ownership