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PLASMA THERM – Mask Etcher® Series

Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher® solution is a key enabler of Moore’s law and shrinking technology nodes.

A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems.

Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm.

Mask Etcher 2-V Evolution

Mask Etcher® Gen 2 Gen 3 Gen 4 GenV
Node (nm) 180 130-90 65-45 32-22


  • Dedicated platform specifically built for the highly specialized photomask market
  • Several front-end handling options:
    – Ballroom/Bulkhead mounting
    – Automated load station (ALS)
    – SMIF on Automated Frond End (AFE)


Integrated multifunctional endpoint capability with EndpointWorks

  • Laser Interferometry
  • OES
  • System Parameters
  • Custom input (e.g. RGA)


  • User friendly SEMI standard interface
  • Comprehensive data logging
  • Real-time process data display
  • Fully integrated endpoint system
  • Factory automation compatible (SECS/GEM)
  • Multiple user access levels
  • Alarm history


  • Compensation for uniformity and loading effect
  • Low etch bias
  • Good feature fidelity
  • Low particle and defect
  • Low line edge roughness
  • Maximized productivity and low cost of ownership

Why Choose Eden Lab

Australian Company
Top Support
Full Spectrum of Products
Years of Experience

Fast Shipping

Ready to Ship Freeze Dryers

Top Support

Local Dedicated Support

Peace of Mind

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