|Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher® solution is a key enabler of Moore’s law and shrinking technology nodes.
A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems.
Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm.
Mask Etcher 2-V Evolution
Integrated multifunctional endpoint capability with EndpointWorks
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