Plasma-Therm’s Odyssey HDRF™ offers scalable, lab-to-Fab configuration, from a single chamber with manual loading, to production-ready systems with two load ports and up to two process chambers.
A single-process chamber Odyssey HDRF™ can be upgraded at any time to dual process chambers. Dual-chamber systems can be configured for single-sided processing or sequential dual-sided processing.
All Odyssey HDRF™ systems are built with highly reliable components to achieve system uptime of greater than 92%.
Specification summary
- Low-temperature stripping from 50° C to 150° C
- High-temperature stripping from 150° C to 250° C
Atmospheric Transfer module (EFEM)
- Two load ports (cassette or SMIF)
- SCARA robot
- Wafer loading zone protected by ISO class 3 FFU
Process chambers
- 13.56 Mhz ICP source
- Hard-anodized aluminum chamber
- Three gas lines standard; one additional gas line optional. Four additional gas lines optional in external gas box.
- Base pressure < 1 mTorr
- Integrated hybrid vacuum pump
Endpoint detection
- Integrated spectroscopy endpoint system
Process characteristics
- Low temperature
- No device damage
- Downstream processes
- Double-sided stripping
