The Takachi is a robust ICP technology based on Plasma-Therm’s proven Shuttlelock® platform now available in a much smaller footprint. The reliable hardware, ease of operation, and low cost make the Takachi ideal for a wide range of uniform, high quality ICP etch applications serving R&D, FA, prototyping, pilot line and low volume production. Backed by Plasma-Therm’s VLSIresearch’s award winning service organization, the Takachi ICP will be the most reliable and ‘always available’ tool on the floor.
Handling
- Load lock with easy 4-button control for continuous processing
- 254mm platen provides adequate load capacity for all applications
- Temperature control of electrode with liquid-to-liquid heat exchanger
- 300W, 13.56 MHz electrode (600W optional)
- 1kW 2MHz inductive ICP source (2kW optional)
- 4 MFCs standard (20 optional) – Gas box is tool mounted or remote
- Compact footprint (<1.0 m2)
- Best-of-breed components for fast availability of parts
- CE/UL compliant
- Robust design with high reliability
Software:
- Industrial PC-based, Cortex® control system
- Endpoint on multi-layer stacks
- Achieve target etch depths
- Run-to-run repeatability (< ± 2% variation w/Endpoint)
- Optical Emission Spectroscopy (OES)
- System-based inputs such as RF match positions, throttle valve position
Processes:
- Extensive ICP etching process library with robust starting recipes
- Multiple film etching film capabilities
- Dielectrics (SiNx, SiO2, a-Si, SiOxNy, SiC, Ta2O5)
- Polymers (photoresist, polyimide, BCB)
- Surface treatment (O2 modification of PSS)
- Surface texturing of Solid State Lighting and Solar cells
- Descum
