[vc_row][vc_column][vc_column_text]Plasma-Therm’s VERSALINE HDPCVD product is a new approach to achieving highly dense and conformal films at low substrate temperatures.
The system utilizes a high-density ICP plasma with a temperature-controlled and biased substrate. Uniform gas injection at the substrate level maximizes film quality.
Hardware
In addition to all of the features and benefits available with the VERSALINE ICP, the VERSALINE HDPCVD offers:
- Flexible & upgradeable handling with 3-inch to 8-inch loading configurations:
LL — single substrate
CX — cassette-to-cassette loading of wafers - Substrate temperature control via mechanical clamp
- Substrate bias at 13.56 MHz
- Low particulate processing environment with thermally managed reactor design — up to 180°C for walls and showerhead
Endpoint
Integrated endpoint capability is available with EndpointWorks®, which supports the following endpoint methodologies:
- Laser Interferometry
- OEI
- OES
- System Parameters
Software
The Cortex control system is a user-friendly, easily managed graphical interface for all aspects of system operation. Cortex is designed to increase efficiency and reduce errors. Important features include the following:
- User-friendly, touchscreen compatible, SEMI-standard interface (E-95)
- Comprehensive data logging and charting (real-time and saved data)
- Automated clean and prep (ACAP) routines with RF-on time, job count, wafer count, and other triggers
- Real-time process data display
- Factory automation compatible with optional SECS/GEM license
- Integrated recipe editor with step and tabular views
- Multiple user access levels
- Multiple logs: alarm history, job history, resource usage
- Integrates with GLANCE data capture and visualization tool
Process
- Low temperature
- Trench Fill
- High-density films
- High uniformity
- Tunable index
- Doping
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