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Plasma-Therm’s VERSALINE ICP is the product resulting from decades of technological evolution. Well-known and accepted product lines including the 790, Shuttlelock, and Versalock all played a role in the development of the VERSALINE ICP.


  • Flexible and upgradeable handling
    – LL — single substrate or batch carrier loader
    – CX — cassette-to-cassette loading of wafers or carriers
  • Loading configurations for single and multiple wafers
  • 2 MHz ICP RF for efficient coupling of power to the plasma
  • ICP source with temperature control capable of high power
  • Substrate temperature control via mechanical clamp or ESC
  • Efficient thermal management with monoblock electrode construction and an active backside helium circuit
  • Flexible substrate bias options with 13.56 MHz and 40MHz
  • Improved preventative maintenance cycles with thermally managed chamber liner and pump train
  • Digital MFCs with filtered and bypassed gas lines
  • Available substrate electrode temperature ranges –40ºC to 180ºC
  • Chambers with corrosion-resistant surfaces
  • Mag-Lev turbo pump
  • Bulkhead or ballroom installation

Endpoint options

Integrated multifunctional endpoint capability with EndpointWorks®:

  • Laser interferometry
  • Optical emission spectroscopy (OES)
  • Optical emission interferemetry (OEI)
  • System parameters (throttle valve position, pressure, forward power, etc.)
  • Custom inputs such as RGA and ellipsometer

Control system

Cortex® control system provides a user-friendly control interface designed for efficiency and productivity. Cortex benefits include:

  • Graphical, touchscreen compatible, SEMI-standard (E-95) interface
  • Comprehensive process parameter charting (real-time and post-processing)
  • Automated clean and prep (ACAP) routines with configurable triggers, including RF-on time, job count, and wafer count
  • Real-time process data display
  • Factory automation host interface (with optional SECS/GEM license)
  • Integrated recipe editor with step and tabular views
  • Per-user access control for menus, screens, commands and recipes
  • Auto logging of alarms, jobs, calibration, and resource usage
  • Integrated with GLANCE data logging and visualization tool


  • Optimized etch rates
  • High uniformity
  • Low particulates
  • Tunable selectivity
  • Multilayer etch detection
  • Profile control
  • Large library of processes for electronic, photonic, MEMS, and nanotechnology applications (material specs available upon request)
    • II-VIs and III-Vs: e.g. GaAs, InP, GaN, AlN, CdTe, InSb
    • Silicon based: e.g. Si, Ge, SiGe, poly-Si, SiC, SiO2, SiNx, quartz
    • Polymers: e.g. PR, PI, BCB
    • Metals: e.g. Al, Cr, V, W, Mo, Ti, Ta, Nb, Cu, Au, Pt
    • Metal oxides and nitrides: e.g. TiN, TaN, TiOx, TaOx
    • Piezoelectrics: e.g. LiNbO3, LiTaO3
  • Corrosive chemistry (e.g. HBr, Cl2, BCl3)  supported with “armored” internal component

Why Choose Eden Lab

Australian Company
Top Support
Full Spectrum of Products
Years of Experience

Fast Shipping

Ready to Ship Freeze Dryers

Top Support

Local Dedicated Support

Peace of Mind

Covered By Australian Law