[vc_row][vc_column][vc_column_text]Plasma-Therm’s VERSALINE PECVD is the result of decades of technological innovation. VERSALINE PECVD systems can deposit many different high-quality films, delivering maximum productivity with low total cost of ownership.
The parallel plate configuration of VERSALINE PECVD is designed to provide a clean processing environment and require little maintenance.
Hardware
- Simple, low-maintenance chamber with reduced surface area and smooth contours for thorough, high-rate cleaning
- Highly uniform fractal-based gas distribution
- 13.56 MHz and dual frequencies available
- Flexible and upgradeable handling configuration:
- ML — direct manual loading
- LL — single substrate or carrier loader
- CX — cassette-to-cassette loading of wafers or carriers
- High temperature electrode up to 350°C
- Low particulate processing environment with thermally managed reactor design — up to 200°C for walls and showerhead
Endpoint
- Integrated multifunctional endpoint capability with EndpointWorks
- Unique OEI application for real-time film thickness and rate monitoring
- OES for optimized chamber clean
Software
- User-friendly SEMI standard interface (E-95)
- Comprehensive data logging
- Automated cleaning program (AMS)
- Real-time process data display
- Fully integrated endpoint system
- Factory automation compatible (SECS/GEM)
- Edit recipes during runs
- Multiple user access levels
- Alarm history
Process
- Stress control
- High uniformity
- Low damage
- Low particulates
- Tunable index
- Increased productivity with short clean cycles
- Conformal SiNx films
- Doping capability (loadlocked versions only)
- Extensive process library
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