[vc_row][vc_column][vc_column_text]Plasma-Therm’s VERSALINE RIE systems are installed in a wide range of production capacity facilities – from R&D through high-volume production. VERSALINE RIE offers low maintenance and high versatility for multiple applications.
Substrate sizes are conveniently accommodated without ever needing hardware reconfiguration. For future upgradeability to ICP, a high conductance option is available.
Hardware
- Simple, low-maintenance design
– Flexible substrate bias options with 13.56 MHz and 40 MHz - Flexible and upgradeable handling
– ML — direct manual loading (single or multi-substrate)
– LL — single substrate or multi-substrate carrier loader
– CX — cassette-to-cassette loading of wafers or carriers - Improved preventative maintenance cycles with thermally managed chamber liner and pump train
- Digital MFCs with filtered and bypassed gas lines
- Mag-Lev turbo pump
- Efficient thermal management with monoblock electrode construction
- Available substrate electrode temperature ranges –40ºC to 180ºC
- Process specific electrode material
Endpoint
Integrated multifunctional endpoint capability with EndpointWorks
Laser Interferometry
- OEI
- OES
- System Parameters
- Custom inputs (e.g., RGA)
Software
- User-friendly SEMI standard interface (E-95)
- Comprehensive data logging
- Automated cleaning program (AMS)
- Real-time process data display
- Fully integrated endpoint system
- Factory automation compatible (SECS/GEM)
- Edit recipes during runs
- Multiple user access levels
- Alarm history
Process
- Tunable selectivity
- Extensive process library
- Wide process latitude
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