[vc_row][vc_column][vc_column_text]The Vision 310 PECVD is a fundamental deposition system for semiconductor fabrication and material science facilities. Used in R&D and low volume production applications, the classic parallel plate configuration provides a wide range of high quality, uniform films.
Simple installation and operation, reliable hardware and software suite, coupled with a small footprint, make the Vision 310 PECVD the most cost effective turnkey solution in its class.
Hardware:
- Optimized showerhead ensures high uniformity deposition
- Mixed frequency 300W 13.56 MHz
500W 100-460 kHz (optional for Si3N4 stress control) - 305mm substrate platen
- Water cooling not required
- High temperature electrode up to 380°C
- Adjustable showerhead to substrate spacing accommodating non-standard substrates
- CE/UL compliant
- DeviceNet (digital) field bus for faster, more accurate, and trouble free operation
- Open load for easy access
- Best-of-breed OEM components (standard “off the shelf”) for fast parts availability
- Digital MFCs (metal sealed, isolated)
- Compact footprint (<0.6 m2)
Software:
- User friendly Digital communication using DeviceNet
- Data logging and recipe manage through open SQL Server environment
- Integrated endpoint control
- Alarm history, multiple user access levels, on-the-fly recipe control
- Real-time process data display
- Easy and safe override maintenance screens
Processes:
- Extensive deposition process library (includes SiNx, SiO2, a-Si, SiOxNy, and SiC)
- Stress control
- High uniformity
- Tunable index
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