PLASMA THERM- Vision 420 RIE

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The Vision 420 RIE provides etching capabilities over a variety of materials and substrates for non-caustic etching (primarily Fluorine based). The small footprint, low cost, ease of use and superior performance makes the Vision 420 an ideal candidate for a wide range of uniform, high quality films serving R&D….

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The Vision 420 RIE provides etching capabilities over a variety of materials and substrates for non-caustic etching (primarily Fluorine based). The small footprint, low cost, ease of use and superior performance makes the Vision 420 an ideal candidate for a wide range of uniform, high quality films serving R&D, prototyping, pilot line and low volume production. The high volume loading allows production for numerous applications such as LED, MEMs, and wireless manufacturing

The 420 is found in production lines, universities and R&D labs worldwide. The reliable hardware and easy to use CORTEX® operating software makes the Vision 420 ideal for researchers and production alike. The extensive experience and large process library enable the users to ‘hit the ground running’ for any RIE etching requirement.

Hardware:

  • Open Load for easy access enabling single or batch processing
  • High temperature electrode up to 350°C
  • 406 mm platen for increased load capacity and high throughput
  • Temperature control of electrode with liquid-to-liquid heat exchanger
  • 600w, 13.56 MHz electrode
  • Up to 8 MFCs
  • Compact footprint (<1.0 m2)
  • Best-of-breed components for fast availability of parts
  • CE/UL compliant
  • Robust design with high reliability

Software:

  • CORTEX® Windows based operating system
  • Data Logging and recipe management
  • Integrated endpoint control for precise etching endpoint
  • Real time process data display
  • Alarm history and corrective actions logged with easy access
  • Multiple User Access – Full access, Maintenance and operator levels

Processes:

  • Extensive RIE etching process library with known starting recipes
  • Multiple film etching film capabilities
    • Dielectrics (SiNx, SiO2, a-Si, SiOxNy, SiC, Ta2O5)
    • Polymers (Photoresist, Polyimide, BCB)
    • Surface treatment (O2 modification of PSS)
    • Surface texturing of Solid State Lighting and Solar cells)
    • Descum
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